MicroLink Devices Engineering Scholarship

The MicroLink Devices Engineering Scholarship is awarded to one or more students majoring in a field of engineering within the College of Engineering and Mines. Recipients shall be in good academic standing (3.0 GPA or greater). Recipients should also be interested in applying their engineering skills towards advancing technology in the fields of aerospace, UAVs, semiconductors, and/or digital and RF communications. Preference shall be given to students who aspire to pursue an advanced degree beyond a B.S. in engineering.